Summary:
SK hynix broke ground August 27 on a more than $4 billion advanced-packaging and research facility at Purdue Research Park. The company plans to open the cleanroom in 2028 and begin mass production of next-generation high-bandwidth memory in 2029. The project includes an advanced-packaging R&D testbed developed with Purdue and is expected to create approximately 1,000 direct jobs and thousands of additional indirect jobs.
Why it matters:
High-bandwidth memory is a critical component of the processors powering advanced AI systems. As the first U.S. production base dedicated to packaging this technology, the facility places Indiana inside the AI hardware supply chain—not simply among states adopting AI. Purdue’s research and talent partnership could also establish West Lafayette as a national center for advanced semiconductor packaging, workforce development and AI infrastructure innovation.
